New Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 6S 6SP Motherboard IC Chip Ball Soldering Net

Price:
US$4.86

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Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 6S 6SP Motherboard IC Chip Ball Soldering Net








Features: 
 
Efficient: quick alignment for operating of reballing   
Easy: positioning pins for precise alignment
Durable: Long Time Operating and Usage Lifetime
Application Model: iphone 6s Plus, 6s 
Function: Repairing or fixing problem of iphone 6s Plus 6s processor

 
Package includes: 
 
1 x BGA Reballing Stencils for iPhone 6s/6SP
 
Details pictures: 
Japan Steel Phone Logic Board BGA Repair Stencil for iPhone  6S 6SP Motherboard IC Chip Ball Soldering Net
Japan Steel Phone Logic Board BGA Repair Stencil for iPhone  6S 6SP Motherboard IC Chip Ball Soldering Net
Japan Steel Phone Logic Board BGA Repair Stencil for iPhone  6S 6SP Motherboard IC Chip Ball Soldering Net
Japan Steel Phone Logic Board BGA Repair Stencil for iPhone  6S 6SP Motherboard IC Chip Ball Soldering Net
Japan Steel Phone Logic Board BGA Repair Stencil for iPhone  6S 6SP Motherboard IC Chip Ball Soldering Net
Japan Steel Phone Logic Board BGA Repair Stencil for iPhone  6S 6SP Motherboard IC Chip Ball Soldering Net
Japan Steel Phone Logic Board BGA Repair Stencil for iPhone  6S 6SP Motherboard IC Chip Ball Soldering Net
Japan Steel Phone Logic Board BGA Repair Stencil for iPhone  6S 6SP Motherboard IC Chip Ball Soldering Net
Japan Steel Phone Logic Board BGA Repair Stencil for iPhone  6S 6SP Motherboard IC Chip Ball Soldering Net