New MECHANIC Unleaded Solder Paste Fast Welding Cellphone Repairs BGA Main Board NAND CHIP Tin Plant Tin Solder Cream

Price:
US$3.88 ~ 4.38

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MECHANIC Unleaded Solder Paste Fast Welding Cellphone Repairs BGA Main Board NAND CHIP Tin Plant Tin Solder Cream

Features:

A

Lead-free low temperature.
Melting point: 138℃

B
Medium temperature
Melting point: 183℃

C
Unleaded high temperature
Melting point: 210-227℃
 

Package Included:

1 x MECHANIC Unleaded Solder Paste

Detail Pictures: