New SP-X Middle Layer BGA Motherboard Special Solder Paste Mainboard Repair Stannum Planting Plant Tin Pulp for Iphone X

Price:
US$8.99

Free Shipping

SP-X Middle Layer BGA Motherboard Special Solder Paste Mainboard Repair Stannum Planting Plant Tin Pulp for Iphone X

Features:

High density, high impedance
Pure alloy compositin
Fine and sticky
Stannum planting, not bubbing
Silver containing highlight
 
Model: SP-X
Weight: 50g
Size: 38 x 31 x 35mm
Melting Point: 158℃

Package Included:

1 x SP-X Middle Layer of BGA Motherboard Special Solder Paste
 
Detail Pictures: